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17th China International Forum on Solid State Lighting (SSLCHINA2020) & 2020 International Forum on

放大字体  缩小字体 发布日期:2020-06-22   来源:中国半导体照明网  浏览次数:764
 Call for Papers 

November. 23-25, 2020

Shenzhen Convention & Exhibition Center Ÿ Guangdong Ÿ China


The 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors (SSLCHINA & IFWS 2019) will be held on November 25-27, 2019 at Shenzhen Convention & Exhibition Center. SSLCHINA & IFWS 2019 is a premier forum for technical and industrial discussions in all areas of power semiconductor and solid-state lighting. It aims to promote collaborative innovation of the whole industry chain including materials growth, equipment, devices and applications in the related areas.

 

Full length manuscripts of accepted papers will be published in IEEE Xplore, and Indexed by EI.

 

Hosts:

China Solid State Lighting Alliance (CSA)

China Advanced Semiconductor Industry Innovation Alliance (CASA)

 

CONTENTS

P201: The Technology in Substrate, Epitaxy and Wafer Growth Equipment (SiC & GaN)

 

- The influence of Materials on Epitaxy (MO source, other PVD source and epitaxial mechanism)

- The Growth and Manufacture of Wafer

- Homo/Heteroepitaxy

- Defects and Characterization

- The Progress of Equipment in Research, Manufacture and Detection

 

P202: Technologies for Power Electronics and Packaging (SiC & GaN)

 

- SiC/GaN based power system

- SiC/GaN Power electronics devices gate driver design

- SiC/GaN Power electronics devices packaging technology

- SiC/GaN Power electronics devices application

- SiC/GaN Power electronics devices reliability

- SiC/GaN Power electronics devices market research

 

P203: RF Technology and 5G Mobile Communication

 

- High Efficiency GaN Microwave Device Technology

- GaN Epitaxial Technology for High Efficiency Microwave Device

- GaN Monolithic Microwave IC Design

- Process and Device Reliability of GaN Microwave Devices

- Large Signal Equivalent Circuit Modeling and Physical Modeling of GaN Microwave Devices

- Application of GaN devices and circuits in mobile communication

- Application of GaN HEMT Device in 5G Mobile Communication

 

P204: Solid-State Ultraviolet Device Technology

 

- AIN and Other Novel Substrate Materials for UV Optoelectronic Devices

- Design and Epitaxial Growth of Nitride Semiconductor UV Light Emitting and Detecting Materials

- P - Type Doping of AlGaN epitaxial films with High Al Composition

- High Efficiency Solid State Ultraviolet Light Emitting Devices

- High Sensitivity Ultraviolet Detection and Imaging Devices

- Light Extraction, Thermal Management and Reliability of Packaging and Modules of UV Light Source

- New Progress of Ultraviolet UV Semiconductor Materials and Devices

 

P205: LED Chip, Packaging, Modules and Reliability

- New Progress of LED Chip Manufacturing Technologies

- High Efficient UV, Blue, Green and Red Chip Technology

- Mounted Chips, Flip Chip and Vertical Chip Technology

- Latest Development of LED Packaging Materials (Substrate, Solid Crystal Materials, Silica Gel, Fluorescent Powder, etc.)

- Fluorescent Powder, Quantum Dot Technology and Coating Technology

- Lens Design and Optic Module

- Chip level and Wafer Level Packaging Technology

- Multi-chip Packaging, Design and Optimization of COB

- New Development of Light Source with High Quality and Full Spectrum

- Advanced Packaging Technology and Manufacturing Technology with High Sigma and Low Color Tolerance

- The New Generation of LED Light Source and Light Engine

 

P206: LED Lighting in Bio-Agriculture

 

- Advances in Biological (Animal and Plant) Responses to Light Qualities

- Bio-Agricultural Light Recipes Technology

- Manufacturing Technology and New Technology of Bio-Agricultural LED Lamps 

- Advances in LED Modern Agriculture (Plant Factory, Seedling Nursery, Supplementary Lighting in Greenhouses, intensive livestock & poultry culture, Aquaculture, Marine Fishing, Propagation of Edible Fungi and Microalgae Plant Protection by Trapping Insets)

- Energy Saving Design in LED for Bio-Agriculture

- New Materials and New Technologies of LED for Agriculture

- Design and Optimization of Low Cost LED for Agriculture

 

P207: Light Quality and Lighting for Health

- Photobiological investigation of light radiation damage and health conditioning,

- Mechanism for the Effects of Light on Visual Health,

- New LED Light Source for Health and Medical Applications,

- Quality evaluation and Application of Light Environment,

- Standardization for Healthy Lighting and Clinical Trials on LED Phototherapy,

- LED Applications in Healthy Lighting and Optical Medicine,

- Light Environmental Design to consider Healthy and Lighting Quality,

- Control Technologies for LED Healthy and Colour Quality Lighting,

- Development and evaluation of Color Quality Metrics including Color Fidelity, Color Gamut, luminance, CCT, and

- Color Quality metrics for different applications.

 

P208: Micro-LED and other Novel Display

 

- Micro-LED Material, Devices, Drive, Characterization and Application Technologies

- OLED Material, Devices, Drive, Characterization and Application Technologies

- Technologies for Laser Display and Lighting

- QLED Material, Devices, Drive, Characterization and Application Technologies

- PerLED and Other Novel Light Emitting Devices

- Advanced Thin Film Technology for Display

- Flexible Backplane and Packaging Technology

- Transparent Conductive Materials

- Circuit Drive and Control Technologies for Novel Display

- Highly Integrated Semiconductor Information Displays ( HISID ) Technologies

 

P209: Ultra-Wide Bandgap Semiconductor and other Advanced Semiconductor

 

- Key equipment technology for fabrication of the ultra-wide bandgap semiconductors

- Fabrication and material study of the ultra-wide bandgap semiconductors

- Power electronics technology of the ultra-wide bandgap semiconductors

- Optoelectronic device technology of the ultra-wide bandgap semiconductors

- Research and application of other new semiconductor materials

 

P210: Technologies for Reliability and Thermal Management

 

- Novel Materials for Heat Dissipation

- Thermal Management Technologies

- Reliability Oriented Design

- Fault Diagnosis and Prediction

- Failure Detection and Failure Analysis

- Accelerated Life Testing and Prediction Methods

- Failure Mode and Simulation

- Control and Reliability Screening in Manufacturing Process

 

P301: Technology for Driver, Intelligent Control and Smart Lighting / Visible Light Communication and 5G Connection Summit

 

- Power Management and High Efficiency Driving Solutions

- IC New Drive Circuit and Integrated IC

- LED Dimming and Modulating Color Temperature Techniques

- Solution for Controlling of LED Product

- Wireless Communications (ZigBee, Bluetooth, Wifi, Thread, etc.)

- Visible Light Communication Technologies and Applications (Lifi, etc.)

- Integration Of Intelligent Lighting and Smart Home System

- New Interconnection Technologies

- Intelligent LED Lighting System and Sensor Technology

- Modularization and Standardization of Drives

- Network Intelligent Lighting and POE Lighting Technologies

 

 

importANT DATES & METHOD OF SUBMISSION

1. Deadline for abstract submission: July 31st, 2020;

2. Paper acceptance notification: August 15th, 2020;

3. Deadline for full paper submission: September 30th, 2020;

4. Full paper acceptance notification: October 20th, 2020;

5. Deadline for softcopy submission of presentations PPT and posters: November 20th, 2020..

 

REVIEW PROCEDURE

1. Authors must submit extended abstracts in advance.

2. Authors will be informed of paper acceptance with categories of Oral Presentation, Poster Presentation and Conference Proceedings.

3. Authors prepare final submissions depending on the following status:

1) Oral Presentations: Authors need to prepare paper and presentation files (PPT/PDF)

2) Poster Presentations: Authors need to prepare paper and poster files (The Technical Program Committee will audit the posters and inform the authors. Authors need to prepare posters according to the template and bring the hardcopy posters to the designated Poster Display area for wall mounting).

3) Conference Proceedings: Authors should prepare the papers. Authors have to prepare final papers according to the guidelines and given template.

Note:

1) The template can be downloaded from the paper contribution platform of the forum: http://www.sslchina.org/paper?lang=en or http://www.ifws.org.cn/paper?lang=en. Authors are required to prepare papers and other materials based on the provided template in time to pass the review successfully.

2) Full length manuscripts of accepted papers will be published in IEEE Xplore, and Indexed by EI.

 

PAPER REQUIREMENTS

1. Basic Requirements

1) The paper should not have been published in other technical publications or by other technical conferences.

2) Prominent theme, distinct content, accurate data, rigorous discussion, clear conclusion and adopted legal measurement unit.

2. Abstract Submission

Authors are required to submit extended abstracts according to the paper format template given on the conference website.

3. Paper Format

The paper should be written in APA Format according to the paper format template given on the conference website. The papers should adopt Word format. The total pages of the paper are limited to 4.

4. Language of Abstracts, Posters and Papers

1) Abstracts/posters/papers have to be in Standard English.

2) Both Chinese and English are acceptable for oral presentations, but only English can be used for the presentation files (PPT/PDF) and conference proceedings.

Note: No commercial promotions allowed for specific companies and products; otherwise, the papers will not be selected for oral presentations and conference proceedings.

 

For further questions about the paper submission, please contact us,

Lu BAI

Telephone: 010-82387600-602

Email: papersubmission@china-led.net

 
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